COIN612 Infrared Camera Module
Light & Flexible Uncooled Thermal Module with LWIR 640x512 / 12μm
Infrared Detector Sensor
Product Description
COIN612/R infrared thermal camera module adopts state-of-the-art
12μm VOx microbolometer technology. It integrates 640x512 / 12μm
wafer level package (WLP) infrared thermal detector, high
performance signal processing circuit and image processing
algorithm.
The COIN612/R infrared camera core presents sharp and detailed
thermal images and has an optional thermographic function with
measurement range from -20℃~550℃.
COIN612/R infrared camera module provides a standard set of
interfaces for customers, which can be easily integrated into many
kinds of devices like unmanned aerial vehicles (UAV), drones, as
well as police and firefighting units. It is beneficial to OEM
customers for secondary development and integration in all kinds of
thermal imagers and infrared thermographic cameras.
Main Features
- Compact size, light weight
- Precise temperature measurement
- Suitable for various infrared products
- A wide range of thermal imaging applications
- Low Power Consumption
Product Specifications
| Model | COIN612/R |
| IR Detector Performance |
| Resolution | 640x512 |
| Pixel Pitch | 12μm |
| Spectral Range | 8~14μm |
| NETD | <40mk |
| Image Processing |
| Frame Rate | 25Hz/30Hz/50Hz/60Hz |
| Start-up Time | <3s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV/BT656 |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally |
| Image Algorithm | NUC/AGC/IDE/DNR |
| Electrical Specification |
| Standard External Interface | 30pin_HRS |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 3.5~5.5V |
| Typical Power Consumption | <0.75W |
| Temperature Measurement |
| Operating Temperature Range | -10°C~50°C |
| Temperature Measurement Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±3°C or ±3% (Take the Maximum Value) |
| SDK | Support ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics |
| Dimension (mm) | 25.4x25.4x14.1 (With Shutter) |
| Weight | Module: 13g±0.5g (With Shutter)
Module+8.8mm Lens: 22.4g±0.5g
Module+13mm Lens: 41g±0.5g
Module+19mm Lens: 43.9g±0.5g |
| Environmental Adaptation |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics |
| Optional Lens | Fixed Focus Athermal: 8.8mm/13mm/19mm |
Industrial Applications
The COIN612/R infrared camera module is widely used in
Thermography, Security & Monitoring, Outdoors, Firefighting &
Rescue, AIoT, Intelligent Hardware, UAV Payloads, ADAS etc.
About Global Sensor Technology
FAQs
1. What is the difference between low light, active IR and thermal
imaging?
Low light needs natural light and transforms weak natural light
image into enhanced electronic image through image intensifier;
Active IR actively emits infrared light and uses infrared beam
reflected by the target. It has very poor concealment;
Thermal imaging doesn’t need any light and is a passive infrared
night vision that detects infrared radiation difference between
targets and scene or different parts of an object. not be affected
by the changes of the surrounding lighting conditions, during night
or even in fog, rain and other harsh environments.
2. Can you block thermal imaging?
In most cases, you cannot. But infrared rays can't penetrate walls,
and also the glass can block IR. So, if you don’t want to be
detected, you can conceal behind glass or walls to block the
thermal imaging.
